TSOP

Short for Thin Small Outline Package, it's a surface-mount memory packaging from Intel. Features of the TSOP include the following: JEDEC and EIAJ standard dimensions, it's the smallest leaded package form factor for flash, 0.5 mm (19.7 mil) lead pitch, reduced total package height, 1.20 mm maximum, gull wing formed leads, and supports future flash density and feature growth. Intel's TSOP package is offered in 32-lead, 40-lead, 48-lead and 56-lead versions in JEDEC and EIAJ registered standard dimensions.

Short for Small Outline Package, it's a low-profile rectangular surface-mount component package. Its chip is bonded to an inner land contact area (usually a lead frame). External terminals exit parallel to the seating plane on two opposite sides of the moulded, flat package. SOPs use gull wing formed leads, and is a surface mount package with a fixed lead pitch of .050'.